JPH0122988B2 - - Google Patents
Info
- Publication number
- JPH0122988B2 JPH0122988B2 JP23090782A JP23090782A JPH0122988B2 JP H0122988 B2 JPH0122988 B2 JP H0122988B2 JP 23090782 A JP23090782 A JP 23090782A JP 23090782 A JP23090782 A JP 23090782A JP H0122988 B2 JPH0122988 B2 JP H0122988B2
- Authority
- JP
- Japan
- Prior art keywords
- case
- terminal
- base
- portions
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 11
- 238000010008 shearing Methods 0.000 claims description 5
- 239000012212 insulator Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 7
- 210000000078 claw Anatomy 0.000 description 4
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1028—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being held between spring terminals
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23090782A JPS59123253A (ja) | 1982-12-28 | 1982-12-28 | 端子一体形ケ−スと端子の切断方法 |
CA000444220A CA1214835A (en) | 1982-12-28 | 1983-12-23 | Piezoelectric resonator |
US06/565,043 US4532451A (en) | 1982-12-28 | 1983-12-23 | Terminals and mounting for piezoelectric resonators |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23090782A JPS59123253A (ja) | 1982-12-28 | 1982-12-28 | 端子一体形ケ−スと端子の切断方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59123253A JPS59123253A (ja) | 1984-07-17 |
JPH0122988B2 true JPH0122988B2 (en]) | 1989-04-28 |
Family
ID=16915156
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23090782A Granted JPS59123253A (ja) | 1982-12-28 | 1982-12-28 | 端子一体形ケ−スと端子の切断方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59123253A (en]) |
-
1982
- 1982-12-28 JP JP23090782A patent/JPS59123253A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59123253A (ja) | 1984-07-17 |
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